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- The First High-Yield, Sub-Penny Plastic Processor - IEEE Spectrum
The First High-Yield, Sub-Penny Plastic Processor - IEEE Spectrum
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It took a major redesign for cheap flexible chips to reach their promise
Fabrication technology of SiGe hetero-structures and their properties - ScienceDirect
SoftCubes: Stretchable and self-assembling three-dimensional soft modular matter - Sehyuk Yim, Metin Sitti, 2014
Crystal engineering and thin-film deposition strategies towards improving the performance of kesterite photovoltaic cell - ScienceDirect
The First High-Yield, Sub-Penny Plastic Processor - IEEE Spectrum
Interface Vol. 28, No. 3, Fall 2019 by The Electrochemical Society - Issuu
Quantifying the subsurface damage and residual stress in ground silicon wafer using laser ultrasonic technology: A Bayesian approach - ScienceDirect
Ultrasonic Non-destructive Materials Characterization
Researchers Uncover the Fastest Semiconductor Yet - IEEE Spectrum
PDF) All-Printed and Roll-to-Roll-Printable 13.56-MHz-Operated 1-bit RF Tag on Plastic Foils
